• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Patent holdings for IPC class H01L 21/687

Total number of patents in this class: 6318

10-year publication summary

320
411
571
724
751
745
719
745
689
224
2015 2016 2017 2018 2019 2020 2021 2022 2023 2024

Principal owners for this class

Owner
All patents
This class
Applied Materials, Inc.
16587
1064
Tokyo Electron Limited
11599
645
Lam Research Corporation
4775
407
Taiwan Semiconductor Manufacturing Company, Ltd.
36809
279
Screen Holdings Co., Ltd.
2431
276
Semes Co., Ltd.
1119
170
Samsung Electronics Co., Ltd.
131630
143
ASML Netherlands B.V.
6816
126
ASM IP Holding B.V.
1715
110
Ebara Corporation
1951
107
Kokusai Electric Corporation
1791
77
Disco Corporation
1745
70
LAM Research AG
188
68
Brooks Automation US, LLC
348
59
Kawasaki Heavy Industries, Limited
1524
52
NGK Insulators, Ltd.
4589
51
Varian Semiconductor Equipment Associates, Inc.
1282
48
Beijing Naura Microelectronics Equipment Co., Ltd.
430
44
EV Group E. Thallner GmbH
376
40
Kioxia Corporation
9847
40
Other owners 2442